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Showing 6-12 of 12 Results
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2009-06-04
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12
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[views]:399
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Quad PSE controller addresses PoE+ standard
The LTC4266 is a four-port PoE controller for power sourcing equipment (PSE) required to provide IEEE 802.3at (25.5 W) or proprietary higher power levels. Providing up to 100 W over four-pair Ethernet cabling, the controller is compliant with the new IEEE 802.3at PoE+ standard and backward compatible with the prior IEEE 802.3af standard. To help conserve power, the controller delivers the industry’s lowest heat dissipation by using low RDS(on) MOSFETs and 0.25-Ω sense resistors, eliminating the need for heat sinks.
The POE controller is suitable for a wide variety of PSE applications, including next-generation switches, routers, hubs, and midspans. It uses a proprietary dual-mode four-point detection mechanism that ensures immunity from false PD detection. Power management functions include prioritized fast shutdown, 14.5-bit-per-port voltage and current readback, 8-bit programmable current limits, and 7–bit programmable overload current limits. A 1-MHz I2C interface allows a host controller to digitally configure the IC or query port readings. ($6.95 ea/1,000 — available now.)
Learn more about Linear Technology Corp.
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2009-06-02
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11
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[views]:241
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MCU features Cortex-M3 core, 480-Mbit/s USB, 256 Kbytes of flash
The SAM3U flash 32-bit MCU is based on a ARM Cortex-M3 core with a 96MHz clock rate at 1.8 V and features a high-speed 480-Mbit/s USB device. It also has a 336-Mbit/s SDIO/SD/MMC interface, a 42-Mbit/s SPI port, a 1-Msample/s 12-bit A/D converter, and a 500+-Mbit/s external bus interface. The chip provides a five-layer bus matrix, 23 DMA channels, up to 56 Kbytes of SRAM split in three blocks, and up to 256 Kbytes of flash in two banks. The dual-bank flash supports in-application programming.
Additional features include five UARTs, dual I2C, I2S, timers, and a chip ID. The device operates at 1.62 to 3.6 V, and comes in 100- and 144-pin QFP and BGA packages. The chip’s high-speed DMAs have a dedicated layer in the bus matrix, maximizing parallel data transfers. The high data bandwidth architecture enables the IC to simultaneously stream several 100-Mbit/s peripherals, while processing the payload, and controlling the system. ($3.50 ea/10,000 — available now.)
Learn more about Atmel
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2009-02-27
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10
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[views]:375
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Resistors offer power rating up to 750 mW
This article was posted on 02/27/2009 and scheduled for print publication in April 2009.
Resistors offer power rating up to 750 mW
Other specifications include long-term stability to ±0.005% and low typical TCR of ±0.2 ppm/°C
Designed for avionics, military, and space applications, the wraparound surface-mount Bulk Metal Z Foil resistors are the industry’s first devices to provide high-power ratings up to 750 mW at 70°C. Specifications include long-term stability to ±0.005%, low typical TCR of ±0.2 ppm/°C, a power coefficient of resistance of ±5 ppm at rated power, and tight tolerance of ±0.02%.
The resistors feature a low thermal EMF of less than 0.1 μV/°C, voltage coefficient below 0.1 ppm/V, inductance lower than 0.08 μH, and response time faster than 1 ns. Noise generated by these resistors is less than –40 dB. A post-manufacturing screening option is provided in accordance with EEE-INST-002, DSCC, and EPPL, for devices in the 0805 through 2512 case sizes. (From less than $4 — samples available now, 6 to 8 weeks ARO.)
Vishay Intertechnology, Malvern, PA
3-Mpixel imagers are ready for close-ups
This article was posted on 02/26/2009 and scheduled for print publication in April 2009.
3-Mpixel imagers are ready for close-ups
1/4-in.-format, raw Bayer sensors keep in focus from less than 6 in. to infinity with built-in software-based lensing
The first imaging chips with integrated extended- depth-of-field (EDoF) capability, the 3.15-Mpixel VD6803 and VD6853 provide sharp images at focus distances from infinity down to just 15 cm (5.9 in.), letting them be used for, say, ultra-short-distance optical character recognition, bar-code reading, or macrophotography. The chips can be integrated into camera modules as small as 6.5 x 6.5 mm for use in cell phones, laptops, toys, or machine-vision applications.
The 1/4-in. optical-format CMOS sensors combine a 1.75-μm-pixel process with so-called Software Lens technology — image enhancement filters, including four-channel anti-vignette, that can balance uneven illumination or correct defects on the fly — to optimize image quality and reduce tuning complexity.
The VD6803 has a 10-bit parallel (legacy) interface and is controlled over a two-wire I2C interface, while the VD6853 provides a fully compliant SMIA 1.0 profile-0 serial interface and is controlled over a two-wire CCI interface. Both are able to deliver full-resolution (QXGA) raw Bayer images at 20 fps (80 MHz).
Either type sensor is available as a chip-on-board die or in a through-silicon-via, wafer-level package. (From less than $5 samples, demo kits available now; prod qty 3rd qtr.)
Agilent Technologies Announces High-Frequency/High-Speed EDA Release for Integrated Circuit, Package and Board Co-Design
This article was posted on 02/26/2009 and scheduled for print publication in February 2009.
Agilent Technologies Announces High-Frequency/High-Speed EDA Release for Integrated Circuit, Package and Board Co-Design
Advanced Design System 2009 Co-Design Capabilities Help Design Partners Share Models, Minimize Rework
SANTA CLARA, Calif., Feb. 23, 2009
Agilent Technologies Inc. (NYSE:A) today announced the 2009 release of Advanced Design System (ADS) for high-frequency/high-speed co-design of integrated circuits (IC), packages and boards. The ADS electronic design automation (EDA) release helps circuit, package, board and system designers work with a single EDA platform to share simulation models and minimize design rework, costs and delays in communications product design.
The ADS EDA co-design platform enables verification of high-frequency or high-speed system performance as soon as IC, package and PC board designs become available, either in real parts or in simulated models. With the common system-verification test benches in ADS 2009, designers can identify and correct component interactions that can negatively affect the ability to meet system performance specifications. Catching these interactions early in the design cycle prevents costly rework during final hardware integration.
Applications include:
designing the latest 4G LTE phones, where multimode/multiband compatibility with 3G, 2G, WiFi and Bluetooth(r) must be maintained in the size and price demanded by consumers;
signal integrity analysis and fast eye-diagram optimization of multigigabit, high-speed serial links, where layout geometry, pre-emphasis and equalization are optimized for the lowest bit error rate; and
aerospace-defense communication and radar system integration with costly military-specification components procured through long purchase cycles, where failure leads to project delay, cost overrun and eventual cancellation.
Agilent’s ADS EDA co-design platform is the result of more than two decades of continuous innovation and refinement. Its industry-proven wireless, high-speed and aerospace-defense system integration includes the co-design of Agilent’s own test and measurement instruments.
ADS 2009 offers unique capabilities for co-design with the widest variety of models available today, including:
X-parameters -- the latest Agilent innovation in accurate, non-linear measurement -- can be used directly in ADS simulation to accurately represent off-the-shelf components such as amplifiers and transistors;
3D electromagnetic parameterized components representing metal shields, antenna radomes, absorbers, packages, interconnects, finite dielectric substrates and wire bonds;
transistor-level circuits on RFIC, MMIC, LTCC or laminate RF modules and PC boards;
behavioral models of all types, including Verilog-A/AMS, HDL, MATLAB(r), IBIS, C++ and neural networks;
netlists from HSPICE and Spectre;
measured signal stimulus and data from Agilent signal, network and logic analyzers; and
prebuilt simulation libraries and sources compliant with the latest wireless standards such as LTE, WiMedia and VWAN wireless HD with MIMO antenna characteristics.
“Prebuilt simulation libraries and standards-compliant sources mean that IC and component design houses can collaborate with their system-integration customers to refine specifications and designs before committing to costly and time-consuming hardware sampling and system integration trials,” said How-Siang Yap, ADS product marketing manager with Agilent’s EEsof EDA division. “Reducing even one month-long hardware spin can save up to $1 million. Our customers are excited about this potential savings.”
ADS 2009 also interoperates with Cadence and Mentor back-end design platforms, allowing designers to import:
Cadence Allegro PCB, Advanced Package Designer and System-In-Package physical design data for co-designing with active components; and
Design Rule Check results from Cadence Assura, Mentor Calibre or Triquint MailDRC for viewing and correcting within ADS cost-effective layout environment.
More information about ADS 2009 is available at www.agilent.com/find/eesof-ads2009. To request a demo of ADS 2009, visit www.agilent.com/find/eesof-ads2009-demo.
A high-resolution image of Agilent’s ADS 2009 software is available at www.agilent.com/find/eesof-ads2009_images.
U.S. Pricing and Availability
ADS 2009 is available now, with prices starting at approximately $18,000. It is also available in time-based bundles with ADS, starting at approximately $20,000 per year.
About Agilent EEsof EDA Software
Agilent EEsof EDA is an industry-leading provider of RF-mixed signal circuit and system-design software. Agilent EEsof EDA software is compatible with and is used to design the company’s test and measurement equipment. Additional information is available at www.agilent.com/find/eesof.
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About Agilent Technologies
Agilent Technologies Inc. (NYSE:A) is the world’s premier measurement company and a technology leader in communications, electronics, life sciences and chemical analysis. The company’s 19,000 employees serve customers in more than 110 countries. Agilent had net revenues of $5.8 billion in fiscal 2008. Information about Agilent is available on the Web at www.agilent.com.
IMPORTANT ANNOUNCEMENT
Source: evertiq - Online European Electronics, http://www.evertiq.com/news/13532
Rebound Electronics acquires PACvision
Independent supplier of electronic components, Rebound Technology Group Holdings Ltd, announced today an agreement under which it has acquired the open order book, stock, fixed assets and goodwill of German based PACvision AG for an undisclosed sum.
The announcement follows a quick process from which the agreement was reached to take on existing operations, staff and all of PACvisions existing European offices which will trade as the newly formed PACvision GmbH. The acquisition confirms that Rebound is on course with its plans to build increased and localised expertise and service portfolios targeted to provide real added value to its growing customer base.
With PACvision now part of the Group, Rebound can continue to expand its service offering and geographical reach by working closely with its customers and recognising the need to continually provide enhanced services. The ability to offer long term solutions and global market pricing that is both realistic and workable is core to the group’s long term strategy. PACvision will trade as an independent entity and operate from its four locations in M霵chengladbach, Ottobrunn/Munich, Ludwigsburg and Salzburg.
Commenting on the acquisition, Stephen Griffiths , Rebound’s CFO and newly appointed Managing Director of PACvision GmbH said: "This acquisition is another significant step forward in line with our strategy of working with our customers on a localised level. We believe it allows us to work more closely and truly understand their requirements. The staff at PACvision has many years of experience and a great number of existing customer relationships, PACvision GmbH currently employs 18 staff across the four sites in Germany and Austria. The group’s initial focus will be to maintain stability and develop a strategic growth plan that will enhance the services that we can offer to all of our customers".
Integrated voltage regulators target servers apps
This article was posted on 02/25/2009 and scheduled for print publication in April 2009.
Integrated voltage regulators target servers apps
Advances in control IC, MOSFET, and packaging shrink size and improve efficiency
The second-generation (Gen2) SupIRBuck integrated POL voltage regulators (IR38xxMPbF) feature advances in control IC, MOSFET, and package integration technologies. They target high-performance server, storage, and network communication applications.
The new devices offer a switching frequency from 250 kHz to 1.5 MHz, and deliver 96% efficiency. With a common 5 x 6-mm footprint, the regulator family is designed for 4-, 8-, and 12-A output load current at 1.5-MHz switching frequency. While these devices have an input voltage range of 1.5 to 16 V with 5-V bias, they are optimized for 12 V. They have an output voltage range of 0.7 V to 90% VIN.
The regulator devices are a pin-compatible solution for easy current upgrade. Other key features include overcurrent and overtemperature protection, programmable switching frequency, enable input with input-voltage-monitoring capability, hiccup current limit, soft-start, power-good output, advanced prebias startup, sequencing, and a dedicated device for DDR memory tracking. (Ea/10,000: IR3842, $1.20; IR3831 and IR3841, $1.30; IR3840, $1.75 — available now.)
Low-cost FPGA family offers multiprotocol 3.2-G SerDes
This article was posted on 02/24/2009 and scheduled for print publication in April 2009.
Low-cost FPGA family offers multiprotocol 3.2-G SerDes
65-nm devices are said to offer lowest power consumption available
The third-generation low-cost 65-nm LatticeECP3 FPGA family offers multiprotocol 3.2-G SerDes with XAUI jitter compliance, DDR3 memory interfaces, and DSP capabilities. The devices have 17-K to 149-K logic elements and are said to take 85% less static power and 50% less dynamic power than equivalent Virtex and Stratix parts,
The ICs have up to 320 18 x 18-bit multipliers, up to 7 Mbits of memory, and up to 16 SerDes channels that take only 90 mW/channel at 3.2 Gbits/s and include pre-emphasis and equalization. The chips are supported by the ispLEVER design tool suite.
They come in 256 to 1,156-ball BGA packages and have optional 128-bit AES decryption. (LatticeECP3-70, 67-K LUTs, from $35 ea/25,000 — versions available now and through the 3rd qtr.)
2009年公司新年祝贺语
鼠去牛来辞旧岁，龙飞凤舞庆新春。值此辞旧迎新之际深圳市勒美特电子科技有限公司全体职工谨向关心和支持公司的领导、客户和社会各界人士致以新年的问候和真挚地祝福！祝大家在新的一年里事业顺利，大展鸿图！身体健康，家庭幸福！
在过去的2008年，是我们与广大客户共同进步、合作愉快的一年；是我们与新老朋友携手共进、增进友谊的一年；是我们与业内同仁彰显责任、感恩回报的一年！
回顾过去，我们无比自豪，展望未来，我们信心百倍。送走了一年的辛劳，迎来了又一个崭新的年月，在继往开来的2009年里，我们将迎接更大的挑战和任务！
零时的钟声响彻天涯，新年的列车准时出发。它驮去一个难忘的岁月，迎来了又一度火红的年华！
一元复始，万象更新。2009年，将是我们创造梦想、谱写华章的一年！
开拓事业的犁铧，尽管如此沉重；但我们以非凡的毅力，毕竟一步一步地走过来了！我们相信：有合作伙伴的理解支持，有全体员工的努力奋斗；因为有梦想，我们携手并肩，稳健前行，创下新的辉煌！
2009年公司春节放假通知
2009年春节在即，为了便于公司同仁提前安排好工作和生活，现根据国务院办公厅通知精神及公司的福利政策，将“春节”期间的放假安排通知如下：
国内事业部：
1月25日（星期日）至2月1日（星期日）放假，共8天，2月2日（初八，星期一）上班。其中，国家法定的春节假期为1月25日至31日，共7天；
国际事业部：
1月24日（星期六）至2月1日（星期日）放假，共9天，2月2日（初八，星期一）上班。其中，国家法定的春节假期为1月25日至31日，共7天；
采购部：
1月22日（星期四）至2月3日（星期二）放假，共13天，2月4日（初十，星期三）上班。其中，国家法定的春节假期为1月25日至31日，共7天；
公司的福利政策为任职满一年的员工均可享受带薪休假。
温馨提示：
1）由于公司的春节放假开始时间已提前于国家规定的放假时间，因此不允许员工提前休假或不能按时回公司上班。
2）在节日期间，建议大家多参加有益的活动，注意劳逸结合，如离开工作地点，外出旅游、探亲访友等情况，请在旅途中注意财产和人身安全
Holiday schedule for 2009 Spring Festival
On Jan 9, 2009, Romate publicly gave a notice on Holiday Schedule for 2009 Spring Festival to ensure that all staffs have an uninterrupted and happy holiday on which they gather together with their families and enjoy family happiness.Happy Chinese New year!
The holiday period: Jan 24, 2009 -Feb 01, 2009; 9 days in total.
Battery stack monitor helps squeeze the most juice from battery systems — Linear Technology
This article was posted on 01/01/2009 and scheduled for print publication in January 2009.
Battery stack monitor helps squeeze the most juice from battery systems — Linear Technology
Li-ion batteries are finding their way into more high-power applications because of their high-energy density. For battery-based systems where the typical Li-ion cell has a fully charged voltage of 4.2 V, many cells must be connected in series. That of course means that any single cell failure will disable the entire stack. Therefore, a battery control system is needed to monitor and control each battery cell’s condition. The LTC6802 multicell battery monitoring IC does all those functions, and more. It measures 12 individual battery cells, and although it targets Li-ion battery chemistry it is battery chemistry agnostic, working with NiMH and others.
Multiple ICs can be stacked without optocouplers or isolators, enabling voltage monitoring of every cell in long strings of series-connected batteries. These long battery strings enable high-power rechargeable applications for electric and hybrid electric vehicles (HEVs), scooters, motorcycles, golf carts, and UPS systems. The monitor IC measures all cell voltages, even in the presence of stack voltages over 1,000 V, within 13 ms. Each cell is monitored for undervoltage and overvoltage conditions and an associated MOSFET switch is available to discharge overcharged cells. Each IC communicates via a 1-MHz serial interface with error checking, and includes temperature sensor inputs, GPIO lines, and a precision voltage reference.
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